【NEW】LTCC Multilayer Substrates (NL-Ag8)
Engineered from the base material level to solve High-Frequency Loss.
The newly introduced NL-Ag8 maintains a stable dielectric constant up to 100 GHz, and offers exceptionally low dielectric loss.
NIKKO LTCC Multilayer substrates are low-loss substrates utilizing Ag-based conductors.
They provide power-saving performance and enhance design predictability for next-generation communication applications. Specifically designed for next-generation high-frequency bands (millimeter-wave and 6G), the newly developed NL-Ag8 is a high-end product that redefines conventional limits through fully optimized material design.
Recommended Applications
・High-Frequency Module Substrates (5G/6G & Automotive Radar)
Exhibits minimal variation in dielectric constant up to 100 GHz, minimizing discrepancies between simulation results and actual device performance. Mitigates signal attenuation and heat generation at the material level, significantly improving design predictability.
・Next-Generation Semiconductor Interposers (AI & Data Centers)
Minimizes losses associated with ultra-high-speed transmission. By optimizing the Coefficient of Thermal Expansion (CTE: 10), it reduces thermal stress on surrounding components, ensuring highly reliable connectivity for large-die assembly.
・High-Reliability Ceramic Packages
Achieves both a thinner profile and high robustness with a high flexural strength of 370 MPa (approximately 1.5 times higher than conventional products). Ensures reliable hermetic sealing even in harsh environments.
Features
Stable, Low-Loss Characteristics Up to 100 GHz
Maintains an exceptionally low dielectric dissipation factor (Df) up to ultra-high frequency bands, suppressing loss accumulation across a wide bandwidth. This addresses thermal challenges in next-generation designs while maximizing transmission efficiency.
Mounting Reliability via Strategic CTE Matching
Engineered to match the thermal expansion coefficients of surrounding materials, reducing the risk of cracking during thermal cycling.
Environmental Sustainability through Superior Efficiency
Contributes to overall system energy efficiency by minimizing loss inherent to the material itself.
Material Characteristics
| ITEM | UNIT | TEST CONDITIONS | NL-Ag8 | NL-Ag3 |
|---|---|---|---|---|
| COLOR | ― | ― | WHITE | WHITE |
| DENSITY | g/cm3 | ― | 3.2 | 2.85 |
| BENDING STRENGTH | MPa | ― | 370 | 250 |
| THERMAL EXPANSION | 10-6/K | RT～350℃ | 10 | 5.5 |
| THERMAL CONDUCTIVIT | W/(m・K) | ― | 2.7 | 3.5 |
| DIELECTRIC | ― | 10GHz | 6.7 | 6.9 |
| 20GHz | 6.7 | ― | ||
| 40GHz | 6.7 | ― | ||
| 80GHz | 6.7 | ― | ||
| 100GHz | 6.7 | ― | ||
| LOSS TANGENT | 10-4 | 10GHz | 4 | 60 |
| 20GHz | 8 | ― | ||
| 40GHz | 12 | ― | ||
| 80GHz | 16 | ― | ||
| 100GHz | 19 | ― |
Design Guidelines
Currently under development. If you have any questions, need early-stage specifications, or want to discuss project compatibility, please feel free to reach out to us.
Catalog Download
Suggested Applications
- Next-Generation Communication Infrastructure (5G-Advanced / 6G)
Base station antenna modules designed for ultra-high-speed, high-capacity data transmission,
fully leveraging the substrate’s low-loss performance up to 100 GHz. - Next-Generation Mobility (Automotive Millimeter-Wave Radar)
Autonomous driving sensor substrates that require both high accuracy and miniaturization,
achieved through the combination of high flexural strength (370 MPa) and low dielectric loss. - AI & High-Performance Computing (HPC)
Next-generation interposers featuring an optimized Coefficient of Thermal Expansion (CTE: 10),
Ensuring structural reliability for large-die assemblies. - Satellite Communications & Aerospace/Defense
High-reliability communication devices that require secure hermetic sealing and stable,
wideband signal transmission under harsh environmental conditions.
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