HTCC Multilayer Substrates
The NIKKO HTCC substrates are co-fired multilayer circuit substrates made by Pt conductors and Alumina ceramics and are also available in cavity structures.
Features
- The new NIKKO HTCC substrates with platinum conductors are extremely chemically stable, therefore do not oxidate easily, and can be used in various high-temperature environments.
- Compatible with SDGs and low cost as it does not require plating for surface treatment.
- Bio-friendly material used in a wide range of medical applications.
- Offers the catalytic effect of Pt.
- High strength due to the higher content of alumina compared to typical HTCC material along with high thermal conductivity and low dielectric loss of ceramics.
- High dimensional tolerance (±0.3％)
Material Characteristics
| ITEM | UNIT | HTCC NHP-96 |
|---|---|---|
| DIELECTRIC CONSTANT @1MHz/10GHZ | ― | 9.3/9.0 |
| DIELECTRIC LOSS @1MHz/10GHz | ×10-4 | 2/4 |
| SPECIFIC GRAVITY | g/cm3 | 3.75 |
| THERMIAL CONDUCTIVITY | W/(m・K) | 23 |
| THERMAL EXPANSION COEFFICIENT | ppm/℃ | 6.8 |
| BENDING STRENGTH | MPa | 450 |
| MATERIAL | ― | ALUMINA 96% |
| GREEINSHEET THICKNESS | mm | 0.05～1.0 |
| CONDUCTOR | ― | Pt |
| SURFACE CONDUCTOR | ― | Pt |
| DIMENSIONAL TOLERANCE | % | ±0.3 |
Design Guidelines
| CATEGORY | DRAWING POSITION | ITEM | DESIGN RULES |
|---|---|---|---|
| SUBSTRATE | ― | DIMENSIONS | MAX: 120x 110 |
| ― | THICKNESS | MIN: 0.2mm | |
| ― | CAVITY | AVAILABLE | |
| ― | SHIPPING PACKAGE | SUBSTARTE: SEPARATE DEVICES | |
| ― | SINGULATION | G CUT, LASER, DICING | |
| ― | PATTERN DISTANCE TOLERANCE | MIN：±0.3% | |
| DIELECTRIC | ― | LAYER THICKNESS | 0.07～1.0mm |
| ― | # OF LAYERS | 20 LAYER CIRCUITS AVAILABLE | |
| PATTERN (CO-FIRED) | A | VIA DIMETER | 0.05～0.2mm |
| Ｂ | VIA PITCH | MIN：0.25mm | |
| Ｃ | INTERNAL VIA PAD DIAMETER | STANDARD: VA DIAMETER + 0.05mmΦ | |
| Ｄ | LINE WIDTH | MIN：0.05±0.02(TARGET 0.01)mm | |
| E | LINE SPACE DISTANCE | MIN：0.05±0.02(TARGET 0.01)mm | |
| Ｆ | LINE/VIA PAD DISTANCE | MIN：0.1mm | |
| Ｇ | VIA EDGE/CAVITY EDGE DISTANCE | MIN：0.2mm | |
| Ｈ | VIA EDGE/SUBSTRATE EDGE DISTANCE | MIN：0.2mm | |
| J | PATTERN/SUBSTRATE EDGE DISTANCE | MIN：0.15mm | |
| K | VIA PAD/BULK PATTERN DISTANCE | MIN：0.2mm | |
| L | HOLE DIAMETER | MIN：0.55mm | |
| M | BULK PATTERN/SUBTRATE EDGE DISTANCEMIN:0.15mm | MIN：0.15mm | |
| OVERCOAT (CO-FIRED) | Ｎ | OVERLAP WITH CONDUCTOR | MIN：0.075ｍｍ |
| Ｐ | CLEARANCE FROM VIA | MIN：0.1mm | |
| Q | OVERLAP WITH CONDUCTOR | MIN：0.1mm | |
| R | CLEARANCE FROM CONDUCTOR | MIN：0.1mm | |
| S | PARTIAL OVERLAP WITH VIA | NOT AVAILABLE | |
| T | CLEARANCE FROM SUBSTRATE EDGE | MIN：ZERO | |
| U | PATTERN WIDTH | MIN：0.1mm |
Catalog Download
Product Use Case
- Plasma (Ozone) generators
- Medical applications
- Small device packages – sensor packages
Find Products
Free consultation with easy form that only takes 90 seconds
Feel free to contact us to ask about our products and services.
