Thick Film Printed Circuit Substrates

By utilizing NIKKO’s in-house substrates as the base substrate, these substrates offer not only excellent thermal conductivity but also high reflectivity and insulation. Available in a wide range of substrate sizes and circuit patterns along with the capability of high-density circuits with fine patterns.
With the via-filled substrates, pads on via are available for small high-density circuits. The filled vias can also be used as thermal vias for Chip on Board assemblies and surface mount devices that require thermal dissipation. Thick film resistors can be printed and trimmed for resistance tolerances from ±1%, allowing for reduction of surface mount devices to achieve smaller, high-density circuit boards. Trimming also allows for producing the required resistance values.