Substrate with Improved Surface Properties
This substrate has fewer surface pinholes using the same 96% Alumina composition. This enhances the surface smoothness and is suitable for thin-film circuitry. The substrate surface in the photo has been treated to make the pinholes more visible.
Features
With process improvements, the surface of this substrate has fewer micro-pinholes and offers a smoother surface. It contributes to fewer opens and shorts in the circuit pattern and improved yields.
* pinhole = depression
Material Characteristics
| ITEM | UNIT | TEST CONDITIONS | Surface Improved substrate | 96% ALUMINA | |
|---|---|---|---|---|---|
| NA-96PF | NA-96 | ||||
| MATERIAL | ― | ― | 96%Al2O3 | 96%Al2O3 | |
| COLOR | ― | ― | WHITE | WHITE | |
| DENSITY | g/cm3 | ― | 3.7 | 3.7 | |
| WATER ABSORPTION | % | ― | 0 | 0 | |
| MECHANICAL PROPERTIES | 3 POINT BENDING STRENGTH | MPa | ― | 400 | 400 |
| THERMAL PROPERTIES | THERMAL EXPANSION COEFFICIENT | 10-6/℃ | RT～400℃ | 6.8 | 6.8 |
| RT～800℃ | 7.8 | 7.8 | |||
| THERMAL CONDUCTIVITY | W/(m・K) | 20℃ | 23 | 23 | |
| ELECTRICAL PROPERTIES | DIELECTRIC CONSTANT | ― | 1MHz | 9.2 | 9.2 |
| LOSS TANGENT | 10-4 | 1MHz | 10 | 10 | |
| VOLUME RESISTIVITY | Ω・cm | 25℃ | >1014 | >1014 | |
| 300℃ | 1012 | 1012 | |||
| 500℃ | 1010 | 1010 | |||
| DIELECTRIC STRENGTH | kV/mm | ― | >20 | >20 | |
| PINHOLE | SIZE | μm | ― | APPROX.20 | ― |
| FREQUENCY | ― | ― | LESS | ― | |
Design Guidelines
※Available Substrate Sizes (below)
～300x90mm
※Available Thicknesses (below)
0.635～1.0mmt
※Values are typical, not guaranteed Please contact for other sizes
Catalog Download
Product Use Cases
- Substrates for Thin-film circuit boards
- Thermal printer heads for copiers, various printers
- Thermal printer heads for Point of Sale terminals