{"id":5697,"date":"2023-06-27T11:28:47","date_gmt":"2023-06-27T02:28:47","guid":{"rendered":"https:\/\/www.nikko-company.co.jp\/?post_type=ceramics&#038;p=5697"},"modified":"2025-11-27T16:08:17","modified_gmt":"2025-11-27T07:08:17","slug":"anodic-bondable-wefer","status":"publish","type":"ceramics","link":"https:\/\/www.nikko-company.co.jp\/en\/functional-ceramics-product\/ltcc\/anodic-bondable-wefer\/","title":{"rendered":"Product Wafer Level Packaging Substrates"},"content":{"rendered":"\n<div class=\"l-section wp-block-bhw-wp-blocks-wrapper l-wrapper u-stack-8 m:u-stack-12\">\n<div class=\"l-row__outer\"><div class=\"l-row _gap-4 m:_gap-6 s:_column-reverse wp-block-bhw-wp-blocks-column-row\">\n<div class=\"l-col _col-12 m:_col-8 wp-block-bhw-wp-blocks-column-col\">\n<div class=\"wp-block-bhw-wp-blocks-wrapper l-wrapper u-stack-6 m:u-stack-8\"><div class=\"lazyblock-product-details-tags-ZCaKm0 wp-block-lazyblock-product-details-tags\">\r\n<div>\r\n  <ul class=\"c-tags u-column-stack\">\r\n    \r\n    <li class=\"c-tags__items\">\r\n      <a class=\"c-tags__tag c-tag\" href=\"\/en\/functional-ceramics-product\/ltcc\">\r\n        <span class=\"inner\"><span>LTCC Substrates<\/span><\/span>\r\n      <\/a>\r\n    <\/li>\r\n\r\n            <li class=\"c-tags__items\">\r\n          <a class=\"c-tags__tag c-tag\" href=\"\/en\/functional-ceramics-product\/use\/#mems\">\r\n            <span class=\"inner\"><span>Ceramic packages for MEMS <\/span><\/span>\r\n          <\/a>\r\n        <\/li>\r\n            <li class=\"c-tags__items\">\r\n          <a class=\"c-tags__tag c-tag\" href=\"\/en\/functional-ceramics-product\/use\/#few-terminal\">\r\n            <span class=\"inner\"><span>Semiconductor devices with low terminal count<\/span><\/span>\r\n          <\/a>\r\n        <\/li>\r\n    \r\n            <li class=\"c-tags__items\">\r\n          <a class=\"c-tags__tag c-tag\" href=\"\/en\/functional-ceramics-product\/feature\/#laminated\">\r\n            <span class=\"inner\"><span>Multilayer<\/span><\/span>\r\n          <\/a>\r\n        <\/li>\r\n            <li class=\"c-tags__items\">\r\n          <a class=\"c-tags__tag c-tag\" href=\"\/en\/functional-ceramics-product\/feature\/#wiring-board\">\r\n            <span class=\"inner\"><span>Circuit Board<\/span><\/span>\r\n          <\/a>\r\n        <\/li>\r\n            <li class=\"c-tags__items\">\r\n          <a class=\"c-tags__tag c-tag\" href=\"\/en\/functional-ceramics-product\/feature\/#high-dimensional-accuracy\">\r\n            <span class=\"inner\"><span>Excellent Dimensional Tolerance<\/span><\/span>\r\n          <\/a>\r\n        <\/li>\r\n    \r\n  <\/ul>\r\n<\/div><\/div>\n\n\n<p>The thermal expansion coefficient of these LTCC substrates is adjusted for use as Wafer Level Packaging substrates. The substrate surface has bumps for electrical connectivity and by bonding directly to silicon wafers, allows for easy assembly of CSP (Chip Scale Packaging). Ideal for MEMS and semiconductor ceramic packages with a small number of leads.<\/p>\n<\/div>\n<\/div>\n\n\n\n<div class=\"l-col _col-12 m:_col-4 wp-block-bhw-wp-blocks-column-col\">\n<figure class=\"wp-block-image size-full c-image _full\"><img loading=\"lazy\" decoding=\"async\" width=\"560\" height=\"373\" src=\"http:\/\/www.nikko-company.co.jp\/wp\/wp-content\/uploads\/2022\/07\/anodic-bondable-wefer.jpg\" alt=\"\" class=\"wp-image-1805\" srcset=\"https:\/\/www.nikko-company.co.jp\/wp\/wp-content\/uploads\/2022\/07\/anodic-bondable-wefer.jpg 560w, https:\/\/www.nikko-company.co.jp\/wp\/wp-content\/uploads\/2022\/07\/anodic-bondable-wefer-460x306.jpg 460w\" sizes=\"auto, (max-width: 560px) 100vw, 560px\" \/><\/figure>\n<\/div>\n<\/div><\/div>\n\n\n<div class=\"lazyblock-page-anchors-6m6b4 wp-block-lazyblock-page-anchors\"><div class=\"c-page-anchors\">\n  <div class=\"c-page-anchors__inner\">\n    <ul class=\"c-page-anchors__items\">\n      <li class=\"c-page-anchors__item\"><a class=\"c-page-anchors__link\" href=\"#feature\"><span class=\"inner\"><span>Features<\/span><\/span><\/a><\/li>\n      <li class=\"c-page-anchors__item\"><a class=\"c-page-anchors__link\" href=\"#quality\"><span class=\"inner\"><span>Material Characteristics<\/span><\/span><\/a><\/li>\n      <li class=\"c-page-anchors__item\"><a class=\"c-page-anchors__link\" href=\"#guideline\"><span class=\"inner\"><span>Design Guidelines<\/span><\/span><\/a><\/li>\n      <li class=\"c-page-anchors__item\"><a class=\"c-page-anchors__link\" href=\"#catalog\"><span class=\"inner\"><span>Catalog Download<\/span><\/span><\/a><\/li>\n      <li class=\"c-page-anchors__item\"><a class=\"c-page-anchors__link\" href=\"#use\"><span class=\"inner\"><span>Product Use Cases<\/span><\/span><\/a><\/li>\n    <\/ul>\n  <\/div>\n<\/div><\/div><\/div>\n\n\n\n<section class=\"l-section wp-block-bhw-wp-blocks-wrapper l-wrapper\">\n<h2 class=\"wp-block-heading c-heading _h2\" id=\"feature\">Features<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">Benefits of using a ceramic wafer capable of anodic bonding with silicon<\/h3>\n<\/section>\n\n\n\n<ul class=\"wp-block-list c-list\">\n<li>Miniature,low profile,light weight devices become available<\/li>\n\n\n\n<li>Lower cost with higher units per wafer count and simple assembly process<\/li>\n\n\n\n<li>Faster development stage without the designing of electrical contacts<\/li>\n<\/ul>\n\n\n\n<p>Hermetic sealed packaging technology with electrical connections (Etched Via Wafer)<br>\u203bProducts using this assembly technology will require a license aagreement with Tohoku University.<\/p>\n\n\n\n<section class=\"l-section wp-block-bhw-wp-blocks-wrapper l-wrapper\">\n<h2 class=\"wp-block-heading c-heading _h2\" id=\"quality\">Material Characteristics<\/h2>\n\n\n\n<figure class=\"wp-block-flexible-table-block-table is-style-stripes\"><table class=\"has-fixed-layout\" style=\"width:100%;max-width:800px\"><thead><tr><th style=\"text-align:center;vertical-align:middle\">ITEM<\/th><th style=\"text-align:center;vertical-align:middle\">UNIT<\/th><th style=\"text-align:center\">TEST CONDITIONS<\/th><th style=\"text-align:center\">VALUES<\/th><\/tr><\/thead><tbody><tr><td style=\"text-align:center\">DENSITY<\/td><td style=\"text-align:center\">g\/cm<sup>3<\/sup><\/td><td style=\"text-align:center\">\u2015<\/td><td style=\"text-align:center\">2.43<\/td><\/tr><tr><td style=\"text-align:center\">THERMAL EXPANSION<br>COEFFICIENT<\/td><td style=\"text-align:center\">ppm\/\u2103<\/td><td style=\"text-align:center\">\u2015<\/td><td style=\"text-align:center\">3.4<\/td><\/tr><tr><td rowspan=\"2\" style=\"text-align:center\">BENDING STRENGTH<\/td><td rowspan=\"2\" style=\"text-align:center\">MPa<\/td><td style=\"text-align:center\">POST-FIRING<\/td><td style=\"text-align:center\">150<\/td><\/tr><tr><td style=\"text-align:center\">POST-POLISH<\/td><td style=\"text-align:center\">220<\/td><\/tr><tr><td style=\"text-align:center\">YOUNG MODULUS<\/td><td style=\"text-align:center\">GPa<\/td><td style=\"text-align:center\">\u2015<\/td><td style=\"text-align:center\">81<\/td><\/tr><tr><td style=\"text-align:center\">POISSON COEFFICIENT<\/td><td style=\"text-align:center\">\u2015<\/td><td style=\"text-align:center\">\u2015<\/td><td style=\"text-align:center\">0.23<\/td><\/tr><tr><td style=\"text-align:center\">THERMAL<br>CONDUCTIVITY<\/td><td style=\"text-align:center\">W\/(m\u30fbK)<\/td><td style=\"text-align:center\">\u2015<\/td><td style=\"text-align:center\">1.67<\/td><\/tr><tr><td style=\"text-align:center\">INSULATION<br>RESISTANCE<\/td><td style=\"text-align:center\">\u03a9\u30fbcm<\/td><td style=\"text-align:center\">31\u2103 500VDC<\/td><td style=\"text-align:center\">6.5\u00d710<sup>12<\/sup><\/td><\/tr><tr><td rowspan=\"2\" style=\"text-align:center\">DIELECTRIC CONSTANT<\/td><td rowspan=\"2\" style=\"text-align:center\">\u2015<\/td><td style=\"text-align:center\">1MHz<\/td><td style=\"text-align:center\">5.4<\/td><\/tr><tr><td style=\"text-align:center\">10GHz<\/td><td style=\"text-align:center\">5.1<\/td><\/tr><tr><td rowspan=\"2\" style=\"text-align:center\">DIELECTRIC LOSS<\/td><td rowspan=\"2\" style=\"text-align:center\">\u2015<\/td><td style=\"text-align:center\">1MHz<\/td><td style=\"text-align:center\">0.01<\/td><\/tr><tr><td style=\"text-align:center\">10GHz<\/td><td style=\"text-align:center\">0.01<\/td><\/tr><\/tbody><\/table><figcaption>\u203bValues are typical values, not guaranteed<\/figcaption><\/figure>\n<\/section>\n\n\n\n<section class=\"l-section wp-block-bhw-wp-blocks-wrapper l-wrapper\">\n<h2 class=\"wp-block-heading c-heading _h2\" id=\"guideline\">Design Guidelines<\/h2>\n\n\n\n<figure class=\"wp-block-flexible-table-block-table is-style-stripes\"><table class=\"has-fixed-layout\" style=\"width:100%;max-width:800px\"><thead><tr><th colspan=\"2\" style=\"text-align:center;vertical-align:middle\">ITEM<\/th><th style=\"text-align:center;vertical-align:middle\">STANDARD<\/th><th style=\"text-align:center;vertical-align:middle\">CUSTOM<\/th><\/tr><\/thead><tbody><tr><td style=\"text-align:center\">LAYER THICKNESS<\/td><td style=\"text-align:center\">mm<\/td><td style=\"text-align:center\">0.07(0.05\uff5e0.07)<\/td><td style=\"text-align:center\">0.05(0.035\uff5e0.05)<\/td><\/tr><tr><td style=\"text-align:center\">MAX DIMENSIONS<\/td><td style=\"text-align:center\">inch<\/td><td style=\"text-align:center\">\u03a64<\/td><td style=\"text-align:center\">\u03a66<\/td><\/tr><tr><td style=\"text-align:center\">MIN THICKNESS<\/td><td style=\"text-align:center\">mm<\/td><td style=\"text-align:center\">0.25 @3inch<br>0.3 @4inch<\/td><td style=\"text-align:center\">0.25 @3inch<br>0.3 @4inch<br>0.4 @6inch<\/td><\/tr><tr><td style=\"text-align:center\">CAVITY DEPTH<\/td><td style=\"text-align:center\">mm<\/td><td style=\"text-align:center\">0.025(0.003\uff5e0.05)<\/td><td style=\"text-align:center\">0.025(0.003\uff5e0.05)<\/td><\/tr><tr><td style=\"text-align:center\"># OF LAYERS<\/td><td style=\"text-align:center\">Layer<\/td><td style=\"text-align:center\">MULTILAYER CIRCUITS AVAILABLE<\/td><td style=\"text-align:center\">MULTILAYER CIRCUITS AVAILABLE<\/td><\/tr><tr><td rowspan=\"2\" style=\"text-align:center\">VIA POSITION TOLERANCE<\/td><td rowspan=\"2\" style=\"text-align:center\">\u03bcm<\/td><td style=\"text-align:center\">4 inch WAFER:\u00b1135<\/td><td style=\"text-align:center\">MEMS SIDE : STANDARD\u00b150<br>PREMIUM\u00b135<\/td><\/tr><tr><td style=\"text-align:center\">0.2% OF WAFER RADIUS +35<\/td><td style=\"text-align:center\">TERMINAL SIDE: \u00b150<\/td><\/tr><tr><td style=\"text-align:center\">VIA DIAMETER<\/td><td style=\"text-align:center\">mm<\/td><td style=\"text-align:center\">0.1\u00b10.03<\/td><td style=\"text-align:center\">0.11\u00b10.03<\/td><\/tr><tr><td style=\"text-align:center\">MIN VIA PICTH<\/td><td style=\"text-align:center\">mm<\/td><td style=\"text-align:center\">0.25<\/td><td style=\"text-align:center\">0.25<\/td><\/tr><tr><td style=\"text-align:center\">MIN VIA PITCH (ETCHED VIA BUMP)<\/td><td style=\"text-align:center\">mm<\/td><td style=\"text-align:center\">0.3<\/td><td style=\"text-align:center\">0.3<\/td><\/tr><tr><td style=\"text-align:center\">MIN INTERNAL VIA PAD<br>DIAMETER<\/td><td style=\"text-align:center\">mm<\/td><td style=\"text-align:center\">0.15<\/td><td style=\"text-align:center\">0.15<\/td><\/tr><tr><td style=\"text-align:center\">MIN LINE WIDTH<\/td><td style=\"text-align:center\">mm<\/td><td style=\"text-align:center\">0.075<\/td><td style=\"text-align:center\">0.075<\/td><\/tr><tr><td style=\"text-align:center\">MIN LINE SPACE<\/td><td style=\"text-align:center\">mm<\/td><td style=\"text-align:center\">0.075<\/td><td style=\"text-align:center\">0.075<\/td><\/tr><tr><td style=\"text-align:center\">MIN LINE\/VIA PAD DISTANCE<\/td><td style=\"text-align:center\">mm<\/td><td style=\"text-align:center\">0.1<\/td><td style=\"text-align:center\">0.1<\/td><\/tr><tr><td style=\"text-align:center\">MIN VIA EDGE\/CAVITY EDGE<br>DISTANCE<\/td><td style=\"text-align:center\">mm<\/td><td style=\"text-align:center\">0.2<\/td><td style=\"text-align:center\">0.2<\/td><\/tr><tr><td style=\"text-align:center\">MIN VIA EDGE\/SUBSTRATE<br>EDGE DISTANCE<\/td><td style=\"text-align:center\">mm<\/td><td style=\"text-align:center\">0.2<\/td><td style=\"text-align:center\">0.2<\/td><\/tr><tr><td style=\"text-align:center\">MIN LINE SUBSTRATE EDGE<br>DISTANCE<\/td><td style=\"text-align:center\">mm<\/td><td style=\"text-align:center\">0.15<\/td><td style=\"text-align:center\">0.15<\/td><\/tr><\/tbody><\/table><figcaption>\u203bPlease inquire about designs other than those mentioned above<\/figcaption><\/figure>\n<\/section>\n\n\n\n<section class=\"l-section wp-block-bhw-wp-blocks-wrapper l-wrapper\">\n<h2 class=\"wp-block-heading c-heading _h2\" id=\"catalog\">Catalog Download<\/h2>\n\n\n\n<div class=\"wp-block-bhw-wp-blocks-button\"><a class=\"c-button _md\" href=\"https:\/\/sgfm.jp\/f\/NikkoDocumentDownloadEn\" target=\"_blank\" rel=\"noreferrer noopener\"><span class=\"c-button__text\"><span class=\"inner\">Catalog Download<\/span><\/span><svg class=\"c-button__icon\" aria-label=\"\u65b0\u898f\u30a6\u30a3\u30f3\u30c9\u30a6\" viewBox=\"0 0 12 12\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M3 3V0.6C3 0.257143 3.25714 0 3.6 0H11.4C11.7429 0 12 0.257143 12 0.6V8.4C12 8.74286 11.7429 9 11.4 9H9V11.4C9 11.7429 8.74286 12 8.4 12H0.6C0.257143 12 0 11.7429 0 11.4V3.6C0 3.25714 0.257143 3 0.6 3H3ZM4.2 3H8.4C8.74286 3 9 3.25714 9 3.6V7.8H10.8V1.2H4.2V3ZM1.2 4.2V10.8H7.8V4.2H1.2Z\" fill=\"currentColor\"><\/path><\/svg><\/a><\/div>\n<\/section>\n\n\n\n<section class=\"l-section wp-block-bhw-wp-blocks-wrapper l-wrapper\">\n<h2 class=\"wp-block-heading c-heading _h2\" id=\"use\">Product Use Cases<\/h2>\n\n\n\n<ul class=\"wp-block-list c-list u-stack-2\">\n<li>MEMS and semiconductor ceramic packages with a small number of leads.<\/li>\n<\/ul>\n<\/section>\n","protected":false},"featured_media":0,"parent":5693,"menu_order":65,"template":"single_ceramics-details.php","format":"standard","class_list":["post-5697","ceramics","type-ceramics","status-publish","format-standard","hentry","en-US"],"_links":{"self":[{"href":"https:\/\/www.nikko-company.co.jp\/wp-json\/wp\/v2\/ceramics\/5697","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.nikko-company.co.jp\/wp-json\/wp\/v2\/ceramics"}],"about":[{"href":"https:\/\/www.nikko-company.co.jp\/wp-json\/wp\/v2\/types\/ceramics"}],"version-history":[{"count":2,"href":"https:\/\/www.nikko-company.co.jp\/wp-json\/wp\/v2\/ceramics\/5697\/revisions"}],"predecessor-version":[{"id":9641,"href":"https:\/\/www.nikko-company.co.jp\/wp-json\/wp\/v2\/ceramics\/5697\/revisions\/9641"}],"up":[{"embeddable":true,"href":"https:\/\/www.nikko-company.co.jp\/wp-json\/wp\/v2\/ceramics\/5693"}],"wp:attachment":[{"href":"https:\/\/www.nikko-company.co.jp\/wp-json\/wp\/v2\/media?parent=5697"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}