FAQ: Frequently Asked Questions

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Please contact for inquiries not listed below

Q01. What sizes are available for the Alumina substrates?

A.

The typical largest size available is 200x160mm. Rectangular shapes are available up to 430x110mm. Maximum standard thickness is 1.27mm and up to 2.0mm thicknesses are available per request. We offer customized products for special requirements.

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Q02. Can you make an Alumina substrate with a 0.1mm thickness?

A.

Unfortunately, 0.1mm thick Alumina substrates are not currently available. These are in the development stage. Please contact for specific requirements.

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Q03. What is the via diameter available for Alumina substrates?

A.

Round vias with diameters of 0.2mm are available. Square holes and special shape holes are also available per request. Please contact us for details.

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Q04. Are there standard specifications for Glazed substrates?

A.

We do not offer a standard glazed substrate. All glazed substrates are customized to customer requirements. Please contact for details.

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Q05.  Are glazed substrates available on substrates other than Alumina?

A.

In principle, all oxide based ceramic substrates can be glazed. Please contact for details. Metal substrates and nitride-based material are not offered for glazed substrates.

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Q06.  Do glazed substrates contain environmental hazardous material such as Pb?

A.

The glaze materials are Pb and Cd free.

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Q07.  What are the maximum displacement amount and maximum output of the Multilayer Piezoelectric Actuator?

A.

The displacement and output depends on the electric field strength (applied voltage per thickness) that is applied on the piezoelectric material. By applying higher voltage, more displacement and output can be achieved. However, there is a limit to the voltage that can be applied to the piezoelectric material and NIKKO's material is recommended to be used under 1.5kV/mm. Therefore, the maximum achievable displacement and output is in the area of;

Maximum displacement = (Actuator Height) x 1.5um
Maximum output = (Actuator cross section area) x 3kgf

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Q08.  Do you offer any materials other than NP-6 and NP-7 for Multilayer Piezoelectric material?

A.

Currently, only NP-6 and NP-7 materials are available. NIKKO's focus is the development of the multilayer piezoelectric ceramics using laminated thin sheets. The characteristics of these multilayer piezoelectric ceramics rely on the matching of the piezoelectric material and internal electrodes. The matching of materials is not quantifiable, but NIKKO has developed the NP-6 and NP-7 material with emphasis in matching materials, resulting in a very unique and superior material for multilayer piezoelectric ceramics.

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Q09.  What is the application for the ultrasonic vibrator made by Piezoelectric ceramics?

A.

There are a number of interesting characteristics to ultrasonic and is used in various applications such as, ultrasonic motors, ultrasonic cleaning apparatus, ultrasonic scalpel, wire bonder, and ultrasonic processing equipment. Currently, the ultrasonic vibrator used to generate the ultrasonic is typically a 'Bolted Langevin transducer'. These 'Bolted Langevin transducers are large and require input voltage of 100V to 150V. NIKKO is offering the Multilayer Piezoelectric ultrasonic vibrator as a smaller and low voltage alternative and is highly accepted in various markets. We believe by miniaturizing the ultrasonic vibrator, miniaturization of ultrasonic applications such as, miniature ultrasonic motors, miniature ultrasonic cleaning apparatus and ultrasonic scalpels, become possible.

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Q10.  Do you offer any Dielectric Ceramic substrates with dielectric constants other than the ones listed?

A.

Yes, different Dielectric Constants of the Dielectric ceramics is available. Please contact for details.

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Q11.  Is the temperature coefficient of the Dielectric Ceramic material listed in the specifications adjustable?

A.

Yes, the temperature coefficient of the Dielectric ceramics is adjustable. Please contact for details.

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Q12.  Do you offer anything other than substrates with the Dielectric Ceramic material?

A.

Currently, NIKKO offers only substrates made by Dielectric ceramics. For special requirements, please contact for details.

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Q13. Can the layer thickness of the LTCC substrates be adjusted?

A.

Multilayer substrates are available by combining sheet thicknesses of 25um to 200um. Combinations of sheets with different Dielectric Constants are also available. Please contact for details.

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Q14.  What type of plating process is available for the LTCC substrates?

A.

Electroless Ni-Au plating is available. The Au thickness differs for solder applications and wire bond applications. Please contact for details.

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Q15.  Do LTCC substrates contain environmental hazardous material such as Pb?

A.

Substrates and electrode materials are Pb-free. The Electroless Ni-Au plating layer contains a few hundred ppm of Pb. Pb-free Ni-Au plating is in development. Please contact for details.

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Q16.  What type of conductor material are available for the thick film circuit substrates?

A.

Silver-Platinum (AgPt), Silver-Palladium (AgPd), Gold (Au) are available for thick film conductors. Ni-Au plating finish is available for Silver-Platinum (AgPt), Silver-Palladium (AgPd). Pb-free conductor material is also available. Please contact for details.

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Q17.  What thicknesses are available for the thick film circuit substrates?

A.

Standard thicknesses from 0.4mm to 1.0mm are available. Thicknesses 0.2mm, 0.3mm, 1.27mm are available as custom specifications. Please contact for details.

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Q18.  What diameters are available for the through hole and vias on the thick film circuit substrates?

A.

Standard through hole diameters are 0.3 mm and 0.4mm. Via diameters are 0.2mm and 0.3mm. Please contact for different dimensions. Different shapes are also available. Please contact for details.

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Q19. Are Hybrid COB assemblies available?

A.

Yes, COB assemblies are available. NIKKO can assemble bare chips onto Alumina substrates, LTCC substrates and glass-epoxy substrates. Please contact for details.

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Q20.  What is the smallest size available for the semiconductor assembly package?

A.

Sizes as small as 1.83x1.43x1mm are available. Semiconductor die sizes as small as 0.28x0.28x0.12mm can be used. Please contact for details.

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Q21. What type of CAD data is acceptable?

A.

DXF, DWG, Gerber Data formats are preferred. Other formats can be accepted. Please contact for special requirements.

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